--- /dev/null
+/*
+ * Copyright 2008-2014 Freescale Semiconductor, Inc.
+ *
+ * This program is free software; you can redistribute it and/or
+ * modify it under the terms of the GNU General Public License
+ * Version 2 as published by the Free Software Foundation.
+ */
+
+#ifndef _DDR_SPD_H_
+#define _DDR_SPD_H_
+
+/*
+ * Format from "JEDEC Standard No. 21-C,
+ * Appendix D: Rev 1.0: SPD's for DDR SDRAM
+ */
+typedef struct ddr1_spd_eeprom_s {
+ unsigned char info_size; /* 0 # bytes written into serial memory */
+ unsigned char chip_size; /* 1 Total # bytes of SPD memory device */
+ unsigned char mem_type; /* 2 Fundamental memory type */
+ unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */
+ unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */
+ unsigned char nrows; /* 5 Number of DIMM Banks */
+ unsigned char dataw_lsb; /* 6 Data Width of this assembly */
+ unsigned char dataw_msb; /* 7 ... Data Width continuation */
+ unsigned char voltage; /* 8 Voltage intf std of this assembly */
+ unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */
+ unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */
+ unsigned char config; /* 11 DIMM Configuration type */
+ unsigned char refresh; /* 12 Refresh Rate/Type */
+ unsigned char primw; /* 13 Primary SDRAM Width */
+ unsigned char ecw; /* 14 Error Checking SDRAM width */
+ unsigned char min_delay; /* 15 for Back to Back Random Address */
+ unsigned char burstl; /* 16 Burst Lengths Supported */
+ unsigned char nbanks; /* 17 # of Banks on SDRAM Device */
+ unsigned char cas_lat; /* 18 CAS# Latencies Supported */
+ unsigned char cs_lat; /* 19 CS# Latency */
+ unsigned char write_lat; /* 20 Write Latency (aka Write Recovery) */
+ unsigned char mod_attr; /* 21 SDRAM Module Attributes */
+ unsigned char dev_attr; /* 22 SDRAM Device Attributes */
+ unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-0.5 */
+ unsigned char clk_access2; /* 24 SDRAM Access from
+ Clk @ CL=X-0.5 (tAC) */
+ unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-1 */
+ unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-1 (tAC) */
+ unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/
+ unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */
+ unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */
+ unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */
+ unsigned char bank_dens; /* 31 Density of each bank on module */
+ unsigned char ca_setup; /* 32 Addr + Cmd Setup Time Before Clk */
+ unsigned char ca_hold; /* 33 Addr + Cmd Hold Time After Clk */
+ unsigned char data_setup; /* 34 Data Input Setup Time Before Strobe */
+ unsigned char data_hold; /* 35 Data Input Hold Time After Strobe */
+ unsigned char res_36_40[5];/* 36-40 reserved for VCSDRAM */
+ unsigned char trc; /* 41 Min Active to Auto refresh time tRC */
+ unsigned char trfc; /* 42 Min Auto to Active period tRFC */
+ unsigned char tckmax; /* 43 Max device cycle time tCKmax */
+ unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */
+ unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */
+ unsigned char res_46; /* 46 Reserved */
+ unsigned char dimm_height; /* 47 DDR SDRAM DIMM Height */
+ unsigned char res_48_61[14]; /* 48-61 Reserved */
+ unsigned char spd_rev; /* 62 SPD Data Revision Code */
+ unsigned char cksum; /* 63 Checksum for bytes 0-62 */
+ unsigned char mid[8]; /* 64-71 Mfr's JEDEC ID code per JEP-106 */
+ unsigned char mloc; /* 72 Manufacturing Location */
+ unsigned char mpart[18]; /* 73 Manufacturer's Part Number */
+ unsigned char rev[2]; /* 91 Revision Code */
+ unsigned char mdate[2]; /* 93 Manufacturing Date */
+ unsigned char sernum[4]; /* 95 Assembly Serial Number */
+ unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */
+
+} ddr1_spd_eeprom_t;
+
+/*
+ * Format from "JEDEC Appendix X: Serial Presence Detects for DDR2 SDRAM",
+ * SPD Revision 1.2
+ */
+typedef struct ddr2_spd_eeprom_s {
+ unsigned char info_size; /* 0 # bytes written into serial memory */
+ unsigned char chip_size; /* 1 Total # bytes of SPD memory device */
+ unsigned char mem_type; /* 2 Fundamental memory type */
+ unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */
+ unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */
+ unsigned char mod_ranks; /* 5 Number of DIMM Ranks */
+ unsigned char dataw; /* 6 Module Data Width */
+ unsigned char res_7; /* 7 Reserved */
+ unsigned char voltage; /* 8 Voltage intf std of this assembly */
+ unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */
+ unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */
+ unsigned char config; /* 11 DIMM Configuration type */
+ unsigned char refresh; /* 12 Refresh Rate/Type */
+ unsigned char primw; /* 13 Primary SDRAM Width */
+ unsigned char ecw; /* 14 Error Checking SDRAM width */
+ unsigned char res_15; /* 15 Reserved */
+ unsigned char burstl; /* 16 Burst Lengths Supported */
+ unsigned char nbanks; /* 17 # of Banks on Each SDRAM Device */
+ unsigned char cas_lat; /* 18 CAS# Latencies Supported */
+ unsigned char mech_char; /* 19 DIMM Mechanical Characteristics */
+ unsigned char dimm_type; /* 20 DIMM type information */
+ unsigned char mod_attr; /* 21 SDRAM Module Attributes */
+ unsigned char dev_attr; /* 22 SDRAM Device Attributes */
+ unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-1 */
+ unsigned char clk_access2; /* 24 SDRAM Access from Clk @ CL=X-1 (tAC) */
+ unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-2 */
+ unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-2 (tAC) */
+ unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/
+ unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */
+ unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */
+ unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */
+ unsigned char rank_dens; /* 31 Density of each rank on module */
+ unsigned char ca_setup; /* 32 Addr+Cmd Setup Time Before Clk (tIS) */
+ unsigned char ca_hold; /* 33 Addr+Cmd Hold Time After Clk (tIH) */
+ unsigned char data_setup; /* 34 Data Input Setup Time
+ Before Strobe (tDS) */
+ unsigned char data_hold; /* 35 Data Input Hold Time
+ After Strobe (tDH) */
+ unsigned char twr; /* 36 Write Recovery time tWR */
+ unsigned char twtr; /* 37 Int write to read delay tWTR */
+ unsigned char trtp; /* 38 Int read to precharge delay tRTP */
+ unsigned char mem_probe; /* 39 Mem analysis probe characteristics */
+ unsigned char trctrfc_ext; /* 40 Extensions to trc and trfc */
+ unsigned char trc; /* 41 Min Active to Auto refresh time tRC */
+ unsigned char trfc; /* 42 Min Auto to Active period tRFC */
+ unsigned char tckmax; /* 43 Max device cycle time tCKmax */
+ unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */
+ unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */
+ unsigned char pll_relock; /* 46 PLL Relock time */
+ unsigned char t_casemax; /* 47 Tcasemax */
+ unsigned char psi_ta_dram; /* 48 Thermal Resistance of DRAM Package from
+ Top (Case) to Ambient (Psi T-A DRAM) */
+ unsigned char dt0_mode; /* 49 DRAM Case Temperature Rise from Ambient
+ due to Activate-Precharge/Mode Bits
+ (DT0/Mode Bits) */
+ unsigned char dt2n_dt2q; /* 50 DRAM Case Temperature Rise from Ambient
+ due to Precharge/Quiet Standby
+ (DT2N/DT2Q) */
+ unsigned char dt2p; /* 51 DRAM Case Temperature Rise from Ambient
+ due to Precharge Power-Down (DT2P) */
+ unsigned char dt3n; /* 52 DRAM Case Temperature Rise from Ambient
+ due to Active Standby (DT3N) */
+ unsigned char dt3pfast; /* 53 DRAM Case Temperature Rise from Ambient
+ due to Active Power-Down with
+ Fast PDN Exit (DT3Pfast) */
+ unsigned char dt3pslow; /* 54 DRAM Case Temperature Rise from Ambient
+ due to Active Power-Down with Slow
+ PDN Exit (DT3Pslow) */
+ unsigned char dt4r_dt4r4w; /* 55 DRAM Case Temperature Rise from Ambient
+ due to Page Open Burst Read/DT4R4W
+ Mode Bit (DT4R/DT4R4W Mode Bit) */
+ unsigned char dt5b; /* 56 DRAM Case Temperature Rise from Ambient
+ due to Burst Refresh (DT5B) */
+ unsigned char dt7; /* 57 DRAM Case Temperature Rise from Ambient
+ due to Bank Interleave Reads with
+ Auto-Precharge (DT7) */
+ unsigned char psi_ta_pll; /* 58 Thermal Resistance of PLL Package form
+ Top (Case) to Ambient (Psi T-A PLL) */
+ unsigned char psi_ta_reg; /* 59 Thermal Reisitance of Register Package
+ from Top (Case) to Ambient
+ (Psi T-A Register) */
+ unsigned char dtpllactive; /* 60 PLL Case Temperature Rise from Ambient
+ due to PLL Active (DT PLL Active) */
+ unsigned char dtregact; /* 61 Register Case Temperature Rise from
+ Ambient due to Register Active/Mode Bit
+ (DT Register Active/Mode Bit) */
+ unsigned char spd_rev; /* 62 SPD Data Revision Code */
+ unsigned char cksum; /* 63 Checksum for bytes 0-62 */
+ unsigned char mid[8]; /* 64 Mfr's JEDEC ID code per JEP-106 */
+ unsigned char mloc; /* 72 Manufacturing Location */
+ unsigned char mpart[18]; /* 73 Manufacturer's Part Number */
+ unsigned char rev[2]; /* 91 Revision Code */
+ unsigned char mdate[2]; /* 93 Manufacturing Date */
+ unsigned char sernum[4]; /* 95 Assembly Serial Number */
+ unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */
+
+} ddr2_spd_eeprom_t;
+
+typedef struct ddr3_spd_eeprom_s {
+ /* General Section: Bytes 0-59 */
+ unsigned char info_size_crc; /* 0 # bytes written into serial memory,
+ CRC coverage */
+ unsigned char spd_rev; /* 1 Total # bytes of SPD mem device */
+ unsigned char mem_type; /* 2 Key Byte / Fundamental mem type */
+ unsigned char module_type; /* 3 Key Byte / Module Type */
+ unsigned char density_banks; /* 4 SDRAM Density and Banks */
+ unsigned char addressing; /* 5 SDRAM Addressing */
+ unsigned char module_vdd; /* 6 Module nominal voltage, VDD */
+ unsigned char organization; /* 7 Module Organization */
+ unsigned char bus_width; /* 8 Module Memory Bus Width */
+ unsigned char ftb_div; /* 9 Fine Timebase (FTB)
+ Dividend / Divisor */
+ unsigned char mtb_dividend; /* 10 Medium Timebase (MTB) Dividend */
+ unsigned char mtb_divisor; /* 11 Medium Timebase (MTB) Divisor */
+ unsigned char tck_min; /* 12 SDRAM Minimum Cycle Time */
+ unsigned char res_13; /* 13 Reserved */
+ unsigned char caslat_lsb; /* 14 CAS Latencies Supported,
+ Least Significant Byte */
+ unsigned char caslat_msb; /* 15 CAS Latencies Supported,
+ Most Significant Byte */
+ unsigned char taa_min; /* 16 Min CAS Latency Time */
+ unsigned char twr_min; /* 17 Min Write REcovery Time */
+ unsigned char trcd_min; /* 18 Min RAS# to CAS# Delay Time */
+ unsigned char trrd_min; /* 19 Min Row Active to
+ Row Active Delay Time */
+ unsigned char trp_min; /* 20 Min Row Precharge Delay Time */
+ unsigned char tras_trc_ext; /* 21 Upper Nibbles for tRAS and tRC */
+ unsigned char tras_min_lsb; /* 22 Min Active to Precharge
+ Delay Time */
+ unsigned char trc_min_lsb; /* 23 Min Active to Active/Refresh
+ Delay Time, LSB */
+ unsigned char trfc_min_lsb; /* 24 Min Refresh Recovery Delay Time */
+ unsigned char trfc_min_msb; /* 25 Min Refresh Recovery Delay Time */
+ unsigned char twtr_min; /* 26 Min Internal Write to
+ Read Command Delay Time */
+ unsigned char trtp_min; /* 27 Min Internal Read to Precharge
+ Command Delay Time */
+ unsigned char tfaw_msb; /* 28 Upper Nibble for tFAW */
+ unsigned char tfaw_min; /* 29 Min Four Activate Window
+ Delay Time*/
+ unsigned char opt_features; /* 30 SDRAM Optional Features */
+ unsigned char therm_ref_opt; /* 31 SDRAM Thermal and Refresh Opts */
+ unsigned char therm_sensor; /* 32 Module Thermal Sensor */
+ unsigned char device_type; /* 33 SDRAM device type */
+ int8_t fine_tck_min; /* 34 Fine offset for tCKmin */
+ int8_t fine_taa_min; /* 35 Fine offset for tAAmin */
+ int8_t fine_trcd_min; /* 36 Fine offset for tRCDmin */
+ int8_t fine_trp_min; /* 37 Fine offset for tRPmin */
+ int8_t fine_trc_min; /* 38 Fine offset for tRCmin */
+ unsigned char res_39_59[21]; /* 39-59 Reserved, General Section */
+
+ /* Module-Specific Section: Bytes 60-116 */
+ union {
+ struct {
+ /* 60 (Unbuffered) Module Nominal Height */
+ unsigned char mod_height;
+ /* 61 (Unbuffered) Module Maximum Thickness */
+ unsigned char mod_thickness;
+ /* 62 (Unbuffered) Reference Raw Card Used */
+ unsigned char ref_raw_card;
+ /* 63 (Unbuffered) Address Mapping from
+ Edge Connector to DRAM */
+ unsigned char addr_mapping;
+ /* 64-116 (Unbuffered) Reserved */
+ unsigned char res_64_116[53];
+ } unbuffered;
+ struct {
+ /* 60 (Registered) Module Nominal Height */
+ unsigned char mod_height;
+ /* 61 (Registered) Module Maximum Thickness */
+ unsigned char mod_thickness;
+ /* 62 (Registered) Reference Raw Card Used */
+ unsigned char ref_raw_card;
+ /* 63 DIMM Module Attributes */
+ unsigned char modu_attr;
+ /* 64 RDIMM Thermal Heat Spreader Solution */
+ unsigned char thermal;
+ /* 65 Register Manufacturer ID Code, Least Significant Byte */
+ unsigned char reg_id_lo;
+ /* 66 Register Manufacturer ID Code, Most Significant Byte */
+ unsigned char reg_id_hi;
+ /* 67 Register Revision Number */
+ unsigned char reg_rev;
+ /* 68 Register Type */
+ unsigned char reg_type;
+ /* 69-76 RC1,3,5...15 (MS Nibble) / RC0,2,4...14 (LS Nibble) */
+ unsigned char rcw[8];
+ } registered;
+ unsigned char uc[57]; /* 60-116 Module-Specific Section */
+ } mod_section;
+
+ /* Unique Module ID: Bytes 117-125 */
+ unsigned char mmid_lsb; /* 117 Module MfgID Code LSB - JEP-106 */
+ unsigned char mmid_msb; /* 118 Module MfgID Code MSB - JEP-106 */
+ unsigned char mloc; /* 119 Mfg Location */
+ unsigned char mdate[2]; /* 120-121 Mfg Date */
+ unsigned char sernum[4]; /* 122-125 Module Serial Number */
+
+ /* CRC: Bytes 126-127 */
+ unsigned char crc[2]; /* 126-127 SPD CRC */
+
+ /* Other Manufacturer Fields and User Space: Bytes 128-255 */
+ unsigned char mpart[18]; /* 128-145 Mfg's Module Part Number */
+ unsigned char mrev[2]; /* 146-147 Module Revision Code */
+
+ unsigned char dmid_lsb; /* 148 DRAM MfgID Code LSB - JEP-106 */
+ unsigned char dmid_msb; /* 149 DRAM MfgID Code MSB - JEP-106 */
+
+ unsigned char msd[26]; /* 150-175 Mfg's Specific Data */
+ unsigned char cust[80]; /* 176-255 Open for Customer Use */
+
+} ddr3_spd_eeprom_t;
+
+/* From JEEC Standard No. 21-C release 23A */
+struct ddr4_spd_eeprom_s {
+ /* General Section: Bytes 0-127 */
+ uint8_t info_size_crc; /* 0 # bytes */
+ uint8_t spd_rev; /* 1 Total # bytes of SPD */
+ uint8_t mem_type; /* 2 Key Byte / mem type */
+ uint8_t module_type; /* 3 Key Byte / Module Type */
+ uint8_t density_banks; /* 4 Density and Banks */
+ uint8_t addressing; /* 5 Addressing */
+ uint8_t package_type; /* 6 Package type */
+ uint8_t opt_feature; /* 7 Optional features */
+ uint8_t thermal_ref; /* 8 Thermal and refresh */
+ uint8_t oth_opt_features; /* 9 Other optional features */
+ uint8_t res_10; /* 10 Reserved */
+ uint8_t module_vdd; /* 11 Module nominal voltage */
+ uint8_t organization; /* 12 Module Organization */
+ uint8_t bus_width; /* 13 Module Memory Bus Width */
+ uint8_t therm_sensor; /* 14 Module Thermal Sensor */
+ uint8_t ext_type; /* 15 Extended module type */
+ uint8_t res_16;
+ uint8_t timebases; /* 17 MTb and FTB */
+ uint8_t tck_min; /* 18 tCKAVGmin */
+ uint8_t tck_max; /* 19 TCKAVGmax */
+ uint8_t caslat_b1; /* 20 CAS latencies, 1st byte */
+ uint8_t caslat_b2; /* 21 CAS latencies, 2nd byte */
+ uint8_t caslat_b3; /* 22 CAS latencies, 3rd byte */
+ uint8_t caslat_b4; /* 23 CAS latencies, 4th byte */
+ uint8_t taa_min; /* 24 Min CAS Latency Time */
+ uint8_t trcd_min; /* 25 Min RAS# to CAS# Delay Time */
+ uint8_t trp_min; /* 26 Min Row Precharge Delay Time */
+ uint8_t tras_trc_ext; /* 27 Upper Nibbles for tRAS and tRC */
+ uint8_t tras_min_lsb; /* 28 tRASmin, lsb */
+ uint8_t trc_min_lsb; /* 29 tRCmin, lsb */
+ uint8_t trfc1_min_lsb; /* 30 Min Refresh Recovery Delay Time */
+ uint8_t trfc1_min_msb; /* 31 Min Refresh Recovery Delay Time */
+ uint8_t trfc2_min_lsb; /* 32 Min Refresh Recovery Delay Time */
+ uint8_t trfc2_min_msb; /* 33 Min Refresh Recovery Delay Time */
+ uint8_t trfc4_min_lsb; /* 34 Min Refresh Recovery Delay Time */
+ uint8_t trfc4_min_msb; /* 35 Min Refresh Recovery Delay Time */
+ uint8_t tfaw_msb; /* 36 Upper Nibble for tFAW */
+ uint8_t tfaw_min; /* 37 tFAW, lsb */
+ uint8_t trrds_min; /* 38 tRRD_Smin, MTB */
+ uint8_t trrdl_min; /* 39 tRRD_Lmin, MTB */
+ uint8_t tccdl_min; /* 40 tCCS_Lmin, MTB */
+ uint8_t res_41[60-41]; /* 41 Rserved */
+ uint8_t mapping[78-60]; /* 60~77 Connector to SDRAM bit map */
+ uint8_t res_78[117-78]; /* 78~116, Reserved */
+ int8_t fine_tccdl_min; /* 117 Fine offset for tCCD_Lmin */
+ int8_t fine_trrdl_min; /* 118 Fine offset for tRRD_Lmin */
+ int8_t fine_trrds_min; /* 119 Fine offset for tRRD_Smin */
+ int8_t fine_trc_min; /* 120 Fine offset for tRCmin */
+ int8_t fine_trp_min; /* 121 Fine offset for tRPmin */
+ int8_t fine_trcd_min; /* 122 Fine offset for tRCDmin */
+ int8_t fine_taa_min; /* 123 Fine offset for tAAmin */
+ int8_t fine_tck_max; /* 124 Fine offset for tCKAVGmax */
+ int8_t fine_tck_min; /* 125 Fine offset for tCKAVGmin */
+ /* CRC: Bytes 126-127 */
+ uint8_t crc[2]; /* 126-127 SPD CRC */
+
+ /* Module-Specific Section: Bytes 128-255 */
+ union {
+ struct {
+ /* 128 (Unbuffered) Module Nominal Height */
+ uint8_t mod_height;
+ /* 129 (Unbuffered) Module Maximum Thickness */
+ uint8_t mod_thickness;
+ /* 130 (Unbuffered) Reference Raw Card Used */
+ uint8_t ref_raw_card;
+ /* 131 (Unbuffered) Address Mapping from
+ Edge Connector to DRAM */
+ uint8_t addr_mapping;
+ /* 132~253 (Unbuffered) Reserved */
+ uint8_t res_132[254-132];
+ /* 254~255 CRC */
+ uint8_t crc[2];
+ } unbuffered;
+ struct {
+ /* 128 (Registered) Module Nominal Height */
+ uint8_t mod_height;
+ /* 129 (Registered) Module Maximum Thickness */
+ uint8_t mod_thickness;
+ /* 130 (Registered) Reference Raw Card Used */
+ uint8_t ref_raw_card;
+ /* 131 DIMM Module Attributes */
+ uint8_t modu_attr;
+ /* 132 RDIMM Thermal Heat Spreader Solution */
+ uint8_t thermal;
+ /* 133 Register Manufacturer ID Code, LSB */
+ uint8_t reg_id_lo;
+ /* 134 Register Manufacturer ID Code, MSB */
+ uint8_t reg_id_hi;
+ /* 135 Register Revision Number */
+ uint8_t reg_rev;
+ /* 136 Address mapping from register to DRAM */
+ uint8_t reg_map;
+ /* 137~253 Reserved */
+ uint8_t res_137[254-137];
+ /* 254~255 CRC */
+ uint8_t crc[2];
+ } registered;
+ struct {
+ /* 128 (Loadreduced) Module Nominal Height */
+ uint8_t mod_height;
+ /* 129 (Loadreduced) Module Maximum Thickness */
+ uint8_t mod_thickness;
+ /* 130 (Loadreduced) Reference Raw Card Used */
+ uint8_t ref_raw_card;
+ /* 131 DIMM Module Attributes */
+ uint8_t modu_attr;
+ /* 132 RDIMM Thermal Heat Spreader Solution */
+ uint8_t thermal;
+ /* 133 Register Manufacturer ID Code, LSB */
+ uint8_t reg_id_lo;
+ /* 134 Register Manufacturer ID Code, MSB */
+ uint8_t reg_id_hi;
+ /* 135 Register Revision Number */
+ uint8_t reg_rev;
+ /* 136 Address mapping from register to DRAM */
+ uint8_t reg_map;
+ /* 137 Register Output Drive Strength for CMD/Add*/
+ uint8_t reg_drv;
+ /* 138 Register Output Drive Strength for CK */
+ uint8_t reg_drv_ck;
+ /* 139 Data Buffer Revision Number */
+ uint8_t data_buf_rev;
+ /* 140 DRAM VrefDQ for Package Rank 0 */
+ uint8_t vrefqe_r0;
+ /* 141 DRAM VrefDQ for Package Rank 1 */
+ uint8_t vrefqe_r1;
+ /* 142 DRAM VrefDQ for Package Rank 2 */
+ uint8_t vrefqe_r2;
+ /* 143 DRAM VrefDQ for Package Rank 3 */
+ uint8_t vrefqe_r3;
+ /* 144 Data Buffer VrefDQ for DRAM Interface */
+ uint8_t data_intf;
+ /*
+ * 145 Data Buffer MDQ Drive Strength and RTT
+ * for data rate <= 1866
+ */
+ uint8_t data_drv_1866;
+ /*
+ * 146 Data Buffer MDQ Drive Strength and RTT
+ * for 1866 < data rate <= 2400
+ */
+ uint8_t data_drv_2400;
+ /*
+ * 147 Data Buffer MDQ Drive Strength and RTT
+ * for 2400 < data rate <= 3200
+ */
+ uint8_t data_drv_3200;
+ /* 148 DRAM Drive Strength */
+ uint8_t dram_drv;
+ /*
+ * 149 DRAM ODT (RTT_WR, RTT_NOM)
+ * for data rate <= 1866
+ */
+ uint8_t dram_odt_1866;
+ /*
+ * 150 DRAM ODT (RTT_WR, RTT_NOM)
+ * for 1866 < data rate <= 2400
+ */
+ uint8_t dram_odt_2400;
+ /*
+ * 151 DRAM ODT (RTT_WR, RTT_NOM)
+ * for 2400 < data rate <= 3200
+ */
+ uint8_t dram_odt_3200;
+ /*
+ * 152 DRAM ODT (RTT_PARK)
+ * for data rate <= 1866
+ */
+ uint8_t dram_odt_park_1866;
+ /*
+ * 153 DRAM ODT (RTT_PARK)
+ * for 1866 < data rate <= 2400
+ */
+ uint8_t dram_odt_park_2400;
+ /*
+ * 154 DRAM ODT (RTT_PARK)
+ * for 2400 < data rate <= 3200
+ */
+ uint8_t dram_odt_park_3200;
+ uint8_t res_155[254-155]; /* Reserved */
+ /* 254~255 CRC */
+ uint8_t crc[2];
+ } loadreduced;
+ uint8_t uc[128]; /* 128-255 Module-Specific Section */
+ } mod_section;
+
+ uint8_t res_256[320-256]; /* 256~319 Reserved */
+
+ /* Module supplier's data: Byte 320~383 */
+ uint8_t mmid_lsb; /* 320 Module MfgID Code LSB */
+ uint8_t mmid_msb; /* 321 Module MfgID Code MSB */
+ uint8_t mloc; /* 322 Mfg Location */
+ uint8_t mdate[2]; /* 323~324 Mfg Date */
+ uint8_t sernum[4]; /* 325~328 Module Serial Number */
+ uint8_t mpart[20]; /* 329~348 Mfg's Module Part Number */
+ uint8_t mrev; /* 349 Module Revision Code */
+ uint8_t dmid_lsb; /* 350 DRAM MfgID Code LSB */
+ uint8_t dmid_msb; /* 351 DRAM MfgID Code MSB */
+ uint8_t stepping; /* 352 DRAM stepping */
+ uint8_t msd[29]; /* 353~381 Mfg's Specific Data */
+ uint8_t res_382[2]; /* 382~383 Reserved */
+
+ uint8_t user[512-384]; /* 384~511 End User Programmable */
+};
+
+extern unsigned int ddr1_spd_check(const ddr1_spd_eeprom_t *spd);
+extern void ddr1_spd_dump(const ddr1_spd_eeprom_t *spd);
+extern unsigned int ddr2_spd_check(const ddr2_spd_eeprom_t *spd);
+extern void ddr2_spd_dump(const ddr2_spd_eeprom_t *spd);
+extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd);
+unsigned int ddr4_spd_check(const struct ddr4_spd_eeprom_s *spd);
+
+/*
+ * Byte 2 Fundamental Memory Types.
+ */
+#define SPD_MEMTYPE_FPM (0x01)
+#define SPD_MEMTYPE_EDO (0x02)
+#define SPD_MEMTYPE_PIPE_NIBBLE (0x03)
+#define SPD_MEMTYPE_SDRAM (0x04)
+#define SPD_MEMTYPE_ROM (0x05)
+#define SPD_MEMTYPE_SGRAM (0x06)
+#define SPD_MEMTYPE_DDR (0x07)
+#define SPD_MEMTYPE_DDR2 (0x08)
+#define SPD_MEMTYPE_DDR2_FBDIMM (0x09)
+#define SPD_MEMTYPE_DDR2_FBDIMM_PROBE (0x0A)
+#define SPD_MEMTYPE_DDR3 (0x0B)
+#define SPD_MEMTYPE_DDR4 (0x0C)
+
+/* DIMM Type for DDR2 SPD (according to v1.3) */
+#define DDR2_SPD_DIMMTYPE_UNDEFINED (0x00)
+#define DDR2_SPD_DIMMTYPE_RDIMM (0x01)
+#define DDR2_SPD_DIMMTYPE_UDIMM (0x02)
+#define DDR2_SPD_DIMMTYPE_SO_DIMM (0x04)
+#define DDR2_SPD_DIMMTYPE_72B_SO_CDIMM (0x06)
+#define DDR2_SPD_DIMMTYPE_72B_SO_RDIMM (0x07)
+#define DDR2_SPD_DIMMTYPE_MICRO_DIMM (0x08)
+#define DDR2_SPD_DIMMTYPE_MINI_RDIMM (0x10)
+#define DDR2_SPD_DIMMTYPE_MINI_UDIMM (0x20)
+
+/* Byte 3 Key Byte / Module Type for DDR3 SPD */
+#define DDR3_SPD_MODULETYPE_MASK (0x0f)
+#define DDR3_SPD_MODULETYPE_RDIMM (0x01)
+#define DDR3_SPD_MODULETYPE_UDIMM (0x02)
+#define DDR3_SPD_MODULETYPE_SO_DIMM (0x03)
+#define DDR3_SPD_MODULETYPE_MICRO_DIMM (0x04)
+#define DDR3_SPD_MODULETYPE_MINI_RDIMM (0x05)
+#define DDR3_SPD_MODULETYPE_MINI_UDIMM (0x06)
+#define DDR3_SPD_MODULETYPE_MINI_CDIMM (0x07)
+#define DDR3_SPD_MODULETYPE_72B_SO_UDIMM (0x08)
+#define DDR3_SPD_MODULETYPE_72B_SO_RDIMM (0x09)
+#define DDR3_SPD_MODULETYPE_72B_SO_CDIMM (0x0A)
+#define DDR3_SPD_MODULETYPE_LRDIMM (0x0B)
+#define DDR3_SPD_MODULETYPE_16B_SO_DIMM (0x0C)
+#define DDR3_SPD_MODULETYPE_32B_SO_DIMM (0x0D)
+
+/* DIMM Type for DDR4 SPD */
+#define DDR4_SPD_MODULETYPE_MASK (0x0f)
+#define DDR4_SPD_MODULETYPE_EXT (0x00)
+#define DDR4_SPD_MODULETYPE_RDIMM (0x01)
+#define DDR4_SPD_MODULETYPE_UDIMM (0x02)
+#define DDR4_SPD_MODULETYPE_SO_DIMM (0x03)
+#define DDR4_SPD_MODULETYPE_LRDIMM (0x04)
+#define DDR4_SPD_MODULETYPE_MINI_RDIMM (0x05)
+#define DDR4_SPD_MODULETYPE_MINI_UDIMM (0x06)
+#define DDR4_SPD_MODULETYPE_72B_SO_UDIMM (0x08)
+#define DDR4_SPD_MODULETYPE_72B_SO_RDIMM (0x09)
+#define DDR4_SPD_MODULETYPE_16B_SO_DIMM (0x0C)
+#define DDR4_SPD_MODULETYPE_32B_SO_DIMM (0x0D)
+
+#endif /* _DDR_SPD_H_ */
Code Review / kvmfornfv.git / blobdiff